horizontal packaging machine

Left and right dual-beam fiber optic sensors are used for products with a material thickness above 1CM. The dual-beam sensor is suitable for products with a thickness above 1CM; however, it may not detect materials for very thin products, leading to inaccurate feeding positions. Therefore, different details need to be adjusted based on the customer's specific product. The downward infrared sensor is used for products with a material thickness below 1CM. A single infrared light point senses the material and can promptly sense the front end of the material for positioning.